Sawatec Systems

Duo Series: Perfect Couple

SAWATEC offers combined systems that integrate spin modules or developers with the hotplate series into a single compact cabinet. The Duo series stands out with its durable design and the ability to flexibly combine high-quality SAWATEC instruments, catering to various substrate sizes. The SM and HP series, known for their exceptional uniformity and precise process repeatability, further enhance the performance of the combined systems.

These versatile combined systems are well-suited for laboratory settings, research and development facilities, institutes, and pilot projects. They are available as mobile cabinet units, providing convenience and mobility for different applications.

SM-150/HP-150

SM-200/HP-200

SMD-200/HP-200

SM-150/HP-150 duo

The SM-150/HP-150 duo combines a spin module with a hotplate in a compact cabinet. The SM-150 spin module is ideal for manual and semi-automatic coating of thin films on substrates with minimal or no surface structure. It supports homogeneous coating of commercially available photoresists and coating materials on wafers up to 150 mm (6 inches) or 127 x 127 mm (5″ x 5″) substrates, with a process chamber designed for diameters up to 176 mm.

The HP-150 hotplate is specifically designed for soft-bake and hard-bake processes in lithography, MEMS, and similar applications. It offers a temperature range of up to 250°C, ensuring precise temperature control for high-quality coatings. The HP-150 hotplate accommodates substrates up to 150 mm (6 inches) in diameter or 127 x 127 mm (5 x 5 inches) and thicknesses up to 5 mm.

The SM-150/HP-150 duo can be customized with two HP-150 hotplates or one hotplate suitable for larger substrates (up to 300 mm), providing flexibility to meet different process requirements.

Spin Module SM-150

 

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameters: speed, acceleration, time
  5. Rotational direction can be selected (CW, CCW)
  6. Manual loading and unloading of the substrates
  7. Substrate fixation via vacuum and safety interlock protection
  8. Manual cover with air flow inlet and sensor lock control
  9. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Semi-automatic cartridge dispensing system, 50 ml glass syringe with manual dispensing arm and recirculation function
  2. Manual nitrogen (N2) purge of the process chamber
  3. Start/stop foot switch for ease of operation (cable
    length 1.8 m)
  4. Bowl assembly made of anodised aluminium
  5. Bowl protector made of aluminium or PE
  6. Vacuum pump for SM-150 module
  7. Wafer alignment tool 2 – 6” (round)
 

Hotplate HP-150

 

FEATURES (BASIC CONFIGURATION)

 

  1. Temperature control with digital target and actual value display
  2. Automatic temperature limit switch, no overheating
  3. Hotplate with safety glass, easy cleaning
  4. Easy levelling of the hotplate, prevents discharge of photoresist
  5. Manual substrate fixation via vacuum
  6. Manual loading and unloading of the substrates

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. N2 flushing manually controlled, no oxidation
  2. Simple setup tool for optimal alignment of the hotplate

Spin Module SM-150

 

  1. Speed range: 0 to 10’000 rpm +/-1 rpm
  2. Speed acceleration: 0 – 8’000 rpm in 0,8 sec. / 0 – 10’000 rpm in 1 sec. 1)
  3. Delay: 10’000 rpm – 0 in 2,5 sec. / 8’000 rpm – 0 in 0,8 sec. 1)
  4. Process time up to 2376 seconds
  5. Dosing time 99 seconds/segment

1) Depending on the substrate size and spin chuck type

Hotplate HP-150

 

  1. Temperature range: ambient temperature up to 250°C
  2. Temperature accuracy: +/- 1°C at 100°C
For more details or the documentation please contact our Sales Team via contact form

SM-200/HP-200 duo

The SM-200 Spin Modules are an excellent choice for semi-automatic coating of thin layers. They feature the innovative RCCT system (Round-Closed-Chamber-Technology), which effectively reduces air turbulence over the rotating substrate. This technology enhances coating uniformity by creating a closed chamber environment that quickly saturates with solvents, resulting in slower resist drying and a more homogeneous coating process. This leads to significant savings in media consumption.

The HP-200 hotplate, on the other hand, is specifically designed for precise soft bake and hard bake processes in lithography, MEMS, and similar applications. It offers a default temperature range of up to 250 °C and ensures narrow margins for temperature control, allowing for high coating quality. The HP-200 can accommodate substrates with a diameter of up to 200 mm and thicknesses of up to 18 mm.

Both the SM-200 Spin Modules and the HP-200 hotplate deliver exceptional performance, making them ideal for various coating and baking processes in the semiconductor and MEMS industries.

Spin Module SM-200

 

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start/stop function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameters: speed, acceleration, time
  5. Rotational direction can be selected (CW, CCW)
  6. RCCT system (Round-Closed-Chamber-Technology)
  7. Dynamic dispense arm prepared for up to 4 media lines
  8. Manual loading and unloading of the substrates
  9. Substrate fixation via vacuum and safety interlock protection
  10. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional dispensing lines including precision dosing pumps or syringe
  2. Automatic cartridge dispensing system, 50 ml glass syringe CDS-50
  3. Top side edge bead removal (EBR circular and linear)
  4. Automatic nozzle cleaning including solvent pump
  5. Program controlled Filter Fan Unit (FFU)
  6. Bowl protection insert for easy and efficient cleaning
  7. Wafer alignment tool 1” – 12” (round)
 

Hotplate HP-200

 

FEATURES (BASIC CONFIGURATION)

 

  1. Temperature control with digital target and actual value display
  2. User-friendly process configuration with touch screen panel
  3. Quick start/stop functions for repeat processes
  4. Automatic temperature limit switch, no overheating
  5. Heating ramp up possible with 24 program-steps
  6. Proximity as well as loading pins, adaptable to different substrate sizes
  7. Hotplate with safety glass, easy cleaning
  8. Easy levelling of the hotplate, prevents discharge of photoresist
  9. Manual substrate fixation via vacuum
  10. Manual loading and unloading of the substrates

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. N2 flushing program controlled, no oxidation
  2. HMDS priming program controlled, optimized adhesion
  3. Simple setup tool for optimal alignment of the hotplate

Spin Module SM-200

 

  1. Speed range: 1 to 6’000 rpm +/-1 rpm (optional 10’000 rpm for wafers smaller than 8″)
  2. Difference from set rotation speed to actual value < +/-1 %
  3. Speed acceleration: 0 – 6’000 rpm in 0,8 sec.
  4. Delay: 6’000 – 0 rpm in 0,8 sec.
  5. Process time up to 7’200 seconds with 0,1 sec. steps
  6. Dosing time depends on pump type

Hotplate HP-200

 

  1. Temperature range: ambient temperature up to 250°C
  2. Temperature accuracy: +/- 0.6°C at 100°C
  3. Electrical driven proximity and loading pins (stroke 8 mm)
  4. Program controlled adjustable proximity pins (0.1 mm increments)
  5. Pin-circle-diameters Ø 45mm (2″) / Ø 92mm (4″) / Ø 142mm (6″) / Ø 192mm (8″)
For more details or the documentation please contact our Sales Team via contact form
SMD-200/HP-200 duoThe SM-200 duo instruments are designed for wafer cleaning, development, and etching (depending on the version) as well as baking processes.The SMD-200 module handles the tasks of wafer cleaning and development, while the SMD-200-E version additionally offers etching capabilities. The SAWATEC SMD developers are renowned for their excellent process performance, minimal chemical consumption, and reliable reproducibility, even with thick photoresist layers. They support both puddle and spray development methods, with the choice of process optimized based on application-specific and economic considerations.The HP-200 hotplate is specifically developed for precise soft bake and hard bake processes in lithography, MEMS, and similar applications. It provides a temperature range of up to 250 °C by default, with narrow temperature margins for achieving high-quality coatings. The HP-200 hotplate can accommodate substrates with a maximum diameter of 200 mm and thicknesses up to 18 mm.

Developer SMD-200 / SMD-200-E

 

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
  5. Electrical driven spray arm, with dynamic and static function
  6. Developer line and media tank (2 litre) for one developer included
  7. Nozzle for DI-water-rinse and N2 drying on the spray arm
  8. Nozzles in the process bowl for the backside rinse
  9. Control elements for dosing of the compressed air and vacuum
  10. Rotational direction can be selected (CW, CCW)
  11. Manual loading and unloading of the substrates
  12. Mechanical substrate fixation
  13. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Also available with SMD-200-E and HP-200
  2. Additional developer lines (up to 4 developer lines possible)
  3. Start/stop foot switch for ease of operation
    (cable length 1.8 m)
  4. Separation unit for media exhaust (tank and laboratory equipment)
  5. Developer tank heating system (2 litre)
  6. Spray nozzle made of PEEK respectively stainless steel (0,3 / 0,5mm)
 

Hotplate HP-200

 

FEATURES (BASIC CONFIGURATION)

 

  1. Temperature control with digital target and actual value display
  2. User-friendly process configuration with touch screen panel
  3. Quick start/stop functions for repeat processes
  4. Automatic temperature limit switch, no overheating
  5. Heating ramp up possible with 24 program-steps
  6. Proximity as well as loading pins, adaptable to different substrate sizes
  7. Hotplate with safety glass, easy cleaning
  8. Easy levelling of the hotplate, prevents discharge of photoresist
  9. Manual substrate fixation via vacuum
  10. Manual loading and unloading of the substrates

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. N2 flushing program controlled, no oxidation
  2. HMDS priming program controlled, optimized adhesion
  3. Simple setup tool for optimal alignment of the hotplate

Developer SMD-200 / SMD-200-E

 

  1. Speed range: 0 to 3’000 rpm +/-1 rpm 1)
  2. Speed acceleration: 0 to 3’000 rpm in 0.3 seconds 1)
  3. Process time up to 2376 seconds
  4. Developer spray time 99 seconds/segment
  5. Speed of the spray arm 10 to 100 mm/seconds
  6. Rinse and N2 drying 99 seconds/segment
  7. Heatable process hood up to 50 °C
  8. Spray nozzle made of PEEK (SMD-200) or stainless steel (SMD-200-E): 0.8 mm

1) Slower speed and acceleration for the process recommended

Hotplate HP-200

 

  1. Temperature range: ambient temperature up to 250°C
  2. Temperature accuracy: +/- 0.6°C at 100°C
  3. Electrical driven proximity and loading pins (stroke 8 mm)
  4. Program controlled adjustable proximity pins (0.1 mm increments)
  5. Pin-circle-diameters Ø 45mm (2″) / Ø 92mm (4″) / Ø 142mm (6″) / Ø 192mm (8″)
For more details or the documentation please contact our Sales Team via contact form

Flexible Automation

SAWATEC cluster systems offer a comprehensive solution for customers seeking fully automatic cassette-to-cassette applications. The modular CS series consists of an optical prealigner station and three versatile stations that can be equipped with various process-oriented instruments. SAWATEC has designed configurations tailored to standard process steps, ensuring optimal performance and efficiency.

With its modular and flexible design, including an automatic central load station, the cluster system enables customers to implement customized solutions that meet their specific production needs. This flexibility allows for individualization and optimization of the production process, making the cluster system an ideal choice for customers seeking tailored and efficient solutions in their manufacturing operations, as part of the Challenger series.

ROBO module

ROBO module

The SAWATEC Robo-Module offers a versatile solution by combining a hotplate with a spin module, a spray coater, or a developer, depending on the desired combination. These flexible systems are designed to provide seamless integration of robot modules with modern process instruments. The models can be operated in both manual and automatic modes, offering flexibility in the workflow. With their highly adaptable module configurations, these customized systems are suitable for handling wafers up to 12 inches in size. They provide efficient and reliable solutions for various process requirements, ensuring high-quality results in substrate processing and enabling streamlined operations.

FEATURES (BASIC CONFIGURATION)

 

  1. Flexible design to combine robot module with advanced process instruments
  2. All modules can be operated in the manual or in the automatic mode
  3. Customized systems with highly flexible module configurations
  4. Reliable process instruments, service-friendly and low downtime
  5. Handling wafers from 3, 4, 6, 8 up to 12 inches
  6. Central positioned 6-axis cleanroom approved robot with endeffector
  7. Mechanical pre-alignment station
  8. Carrier station (max. 2 carriers) with customized design adaption for different cassette types
  9. Programming PolyScope graphical user interface on one 12″ touch screen with mounting device
  10. Compact design and minimized space requirements, easy to clean

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Also available with up to three hotplates

PERFORMANCE DATA

  • Handling wafers from 3″, 4″, 6″, 8″ up to 12″

For more details or the documentation please contact our Sales Team via contact form

CS Series: Modular System

The SAWATEC cluster systems are the perfect solution for customers looking for fully automatic cassette-to-cassette applications. The modular CS series is comprised of an optical prealigner station and three flexible stations, which can be equipped with a number of process-oriented instruments. SAWATEC has developed appropriate configurations for standard process steps. Due to its modular, flexible design with an automatic central load station, the cluster system allows the customer to implement individual, customer- specific solutions in the production (Challenger series).

Sirius

Pioneer

Explorer

Orbiter

CS-200-4 sirius

The CS-200-4 Sirius cluster system consists of three stations. The first station is equipped with a spin module SM-200-CS, providing efficient thin layer coating. The second station offers the option of using a developer, either SMD-200-CS for standard development or SMD-200-E-CS for etching processes. In the third station, there are three stacked hotplates and one coolplate for precise temperature control.

Depending on the specific process flow and capacity requirements, additional hotplates can be integrated into the system. This flexibility allows for customization and scalability to meet the needs of various applications. The CS-200-4 Sirius cluster system enables efficient and automated cassette-to-cassette processing, making it an ideal choice for customers seeking a comprehensive and adaptable solution.

FEATURES (BASIC CONFIGURATION)

  1. High flexibility and productivity, quick amortisation
  2. Advanced process instruments for high uniformity
  3. Flexible process module configurations
  4. Automatic wafer detection in the cassette
  5. Compact design and minimized space requirements
  6. Easy to control with 15” touch screen panel
  7. Linux operating system
  8. Optical operating status display of each process module
  9. Free programmable cluster process
  10. Two carriers can be processed at the same time with different substrate sizes
  11. All process modules can be operated in the manual, the automatic or in the cluster mode
  12. Each process module can be operated in the cluster process or as a single module
  13. Access via Ethernet connection for remote diagnostics and maintenance
  14. Secure data transfer with mbNET module and VPN connection
  15. USB connection for onsite software uploads/updates and process data export/import
  16. Each process module is freely accessible and easy to clean
  17. Service-friendly, low downtime and maintenance cost

FEATURES (BASIC CONFIGURATION)

 

  • Substrate sizes: 3”, 4”, 6” up to max. 8” (A maximum of 3 different successive substrate sizes can be processed, 3, 4, 6” or 4, 6, 8”)

For more details or the documentation please contact our Sales Team via contact form

CS-200-4 pioneer

The CS-200-4 Pioneer cluster system features three stations designed for specific process steps. In the first station, there is an iSPRAY-200-CS spray coater, enabling efficient and homogeneous spray coating of substrates. The second station offers the option of using a developer, with the choice between SMD-200-CS for standard development or SMD-200-E-CS for etching processes. The third station comprises three stacked hotplates and one coolplate, providing precise temperature control.

For processes requiring additional hotplates, the CS-200-4 Pioneer cluster system allows for integration based on the specific process flow and capacity requirements. This modular approach ensures flexibility and scalability to meet the needs of diverse applications. With its comprehensive range of capabilities, the CS-200-4 Pioneer cluster system offers an advanced solution for fully automated cassette-to-cassette processing.

FEATURES (BASIC CONFIGURATION)

  1. High flexibility and productivity, thus fast amortization
  2. Modern process instruments for high uniformity
  3. Flexible process module configurations
  4. Automatic wafer detection in the cassette
  5. Compact design and minimal space requirements
  6. Easy control via 15″ touch screen panel
  7. Linux operating system
  8. Optical operating status display of the individual process modules
  9. Freely programmable cluster process
  10. Two carriers can be processed simultaneously with different substrate sizes
  11. All process modules can be operated in manual, automatic or cluster mode
  12. Each process module can be operated in cluster process or as individual module
  13. Access via Ethernet connection for remote diagnostics and maintenance possible
  14. Secure data transmission with mbNET module and VPN connection
  15. USB connection for software uploads/updates and process data export/import on site
  16. Each process module is freely accessible and easy to clean
  17. Service friendly, low downtime and maintenance costs

FEATURES (BASIC CONFIGURATION)

  • Substrate sizes: 3″, 4″, 6″ up to max. 8″ (A maximum of 3 different consecutive substrate sizes can be processed, 3, 4, 6″ or 4, 6, 8″)

For more details or the documentation please contact our Sales Team via contact form

CS-300-4 explorer

The CS-300-4 Explorer cluster system comprises a spin module SM-300-CS in the first station, a developer SMD-300-CS or SMD-300-E-CS (for etching) in the second station, and three stacked hotplates with one coolplate in the third station.

Additional hotplates can be integrated based on process flow and capacity requirements. The CS-300-4 Explorer cluster system offers a modular and flexible solution for fully automated cassette-to-cassette applications, enabling efficient and precise processing in various manufacturing environments.

FEATURES (BASIC CONFIGURATION)

  1. High flexibility and productivity, quick amortisation
  2. Advanced process instruments for high uniformity
  3. Flexible process module configurations
  4. Automatic wafer detection in the cassette
  5. Compact design and minimized space requirements
  6. Easy to control with 15” touch screen panel
  7. Linux operating system
  8. Optical operating status display of each process module
  9. Free programmable cluster process
  10. Two carriers can be processed at the same time with different substrate sizes
  11. All process modules can be operated in the manual, the automatic or in the cluster mode
  12. Each process module can be operated in the cluster process or as a single module
  13. Access via Ethernet connection for remote diagnostics and maintenance
  14. Secure data transfer with mbNET module and VPN connection
  15. USB connection for onsite software uploads/updates and process data export/import
  16. Each process module is freely accessible and easy to clean
  17. Service-friendly, low downtime and maintenance cost

FEATURES (BASIC CONFIGURATION)

  • Substrate sizes: 6”, 8” up to max. 12”

For more details or the documentation please contact our Sales Team via contact form

CS-300-4 orbiter

The cluster system CS-300-4 orbiter is in the first station with a spray coater iSPRAY-300-CS, in the second station with a developer SMD-300-CS or SMD-300-E-CS (etching) and in the third station with 3 stacked hotplates and one coolplate equipped. Depending on the process flow and capacity requirements more hotplates can be integrated.

FEATURES (BASIC CONFIGURATION)

  1. High flexibility and productivity, thus fast amortization
  2. Modern process instruments for high uniformity
  3. Flexible process module configurations
  4. Automatic wafer detection in the cassette
  5. Compact design and minimal space requirements
  6. Easy control via 15″ touch screen panel
  7. Linux operating system
  8. Optical operating status display of the individual process modules
  9. Freely programmable cluster process
  10. Two carriers can be processed simultaneously with different substrate sizes
  11. All process modules can be operated in manual, automatic or cluster mode
  12. Each process module can be operated in cluster process or as individual module
  13. Access via Ethernet connection for remote diagnostics and maintenance possible
  14. Secure data transmission with mbNET module and VPN connection
  15. USB connection for software uploads/updates and process data export/import on site
  16. Each process module is freely accessible and easy to clean
  17. Service friendly, low downtime and maintenance costs

FEATURES (BASIC CONFIGURATION)

  • Substrate sizes: 6”, 8” up to max. 12”

For more details or the documentation please contact our Sales Team via contact form