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HP Series: Easy To Bake

SAWATEC AG offers a range of hotplates designed for soft bake and hard bake processes in lithography, MEMS, and similar applications. The HP series stands out for its exceptional uniformity and precise process repeatability.

The manual and semi-automatic hotplates are known for their sturdy construction and user-friendly operation. With the extensive HP series, you can handle wafers ranging from 150 mm to 900 mm or 12×12 inch substrates.

These hotplates come in portable bench-top, bench-mounted, or mobile cabinet units, providing flexibility and convenience for your specific needs.

HP-150

HP-200

HP-300

HP-600

Developer SMD-200 / SMD-200-E

The SMD-200 is a versatile instrument that handles both cleaning and development processes, while the SMD-200-E extends its capabilities to include etching in addition to cleaning and development. These instruments are specifically designed to process wafers up to 8″ (200 mm) in diameter or substrates up to 6 x 6″ (150 x 150 mm) in size. The process chamber of these instruments operates effectively up to a diameter of Ø 212 mm.

For convenient use in different settings, both the SMD-200 and SMD-200-E are available as either bench-mounted or mobile cabinet units. This flexibility allows users to choose the configuration that best suits their specific needs and workspace requirements.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
  5. Electrical driven spray arm, with dynamic and static function
  6. Developer line and media tank (2 litre) for one developer included
  7. Nozzle for DI-water-rinse and N2 drying on the spray arm
  8. Nozzles in the process bowl for the backside rinse
  9. Control elements for dosing of the compressed air and vacuum
  10. Rotational direction can be selected (CW, CCW)
  11. Manual loading and unloading of the substrates
  12. Mechanical substrate fixation
  13. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional developer lines (up to 4 developer lines possible)
  2. Start/stop foot switch for ease of operation
    (cable length 1.8 m)
  3. Separation unit for media exhaust (tank and laboratory equipment)
  4. Developer tank heating system (2 litre)
  5. Spray nozzle made of PEEK or stainless steel (0,3 / 0,5mm)

PERFORMANCE DATA

  • Speed range: 0 to 3’000 rpm +/-1 rpm 1)
  • Speed acceleration: 0 to 3’000 rpm in 0.3 seconds 1)
  • Process time up to 2376 seconds
  • Developer spray time 99 seconds/segment
  • Speed of the spray arm 10 to 100 mm/second
  • Rinse and N2 drying 99 seconds/segment
  • Heatable process hood up to 50 °C
  • Spray nozzle made of PEEK (SMD-200) or stainless steel (SMD-200-E): 0.8 mm

1) Slower speed and acceleration for the process recommended

For more details or the documentation please contact our Sales Team via contact form

Developer SMD-300 / SMD-300-E

The SMD-300 is a versatile instrument designed for handling cleaning and development processes, while the SMD-300-E extends its capabilities to include etching in addition to cleaning and development. These instruments are specifically designed to process wafers up to 12″ (300 mm) in diameter or substrates up to 8 x 8″ (200 x 200 mm) in size. The process chamber of these instruments operates effectively up to a diameter of Ø 312 mm.

To accommodate different workspace configurations, both the SMD-300 and SMD-300-E are available as either bench-mounted or mobile cabinet units. This flexibility allows users to choose the configuration that best suits their specific requirements and provides convenience in their working environment.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
  5. Electrical driven spray arms, with dynamic and static function
  6. Developer line and media tank (2 litre) for one developer included
  7. Nozzle for DI-water-rinse and N2 drying on the spray arm
  8. Nozzles in the process bowl for the backside rinse
  9. Control elements for dosing of the compressed air and vacuum
  10. Rotational direction can be selected (CW, CCW)
  11. Manual loading and unloading of the substrates
  12. Mechanical substrate fixation
  13. Acoustic signal when the process has finished
  14.  

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional developer lines (up to 4 developer lines possible)
  2. Start/stop foot switch for ease of operation (cable length 1.8 m)
  3. Separation unit for media exhaust (tank and laboratory equipment)
  4. Developer tank heating system (2 litre)
  5. Spray nozzle made of PEEK or stainless steal (0,3 / 0,5 mm)

PERFORMANCE DATA

  • Speed range: 0 to 3’000 rpm +/-1 rpm 1)
  • Speed acceleration: 0 to 3’000 rpm in 0.3 seconds 1)
  • Process time up to 2376 seconds
  • Developer spray time 99 seconds/segment
  • Speed of the spray arm 10 to 100 mm/second
  • Rinse and N2 drying 99 seconds/segment
  • Heatable process hood up to 50 °C
  • Spray nozzle made of PEEK (SMD-300) or stainless steel (SMD-300-E): 0,8 mm

1) Slower speed and acceleration for the process recommended

For more details or the documentation please contact our Sales Team via contact form

Developer SMD-600

The SMD-600 developer is specifically designed for cleaning and developing substrates with dimensions of up to 400 x 400 mm. The process chamber of the SMD-600 can accommodate substrates with a diameter of up to 600 mm, providing ample space for the development process.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
  5. Electrical driven spray arm, with dynamic or static function
  6. Developer line and media tank for one developer included
  7. Nozzle for DI-water-rinse and N2 drying on the spray arm
  8. Control elements for dosing of the compressed air and vacuum
  9. Rotational direction can be selected (CW, CCW)
  10. Manual loading and unloading of the substrates
  11. Mechanical substrate fixation
  12. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional developer lines (up to 4 developer lines possible)
  2. Start/stop foot switch for ease of operation (cable length 1.8 m)
  3. Separation unit for media exhaust (tank and laboratory equipment)
  4. Developer tank heating system (2 litre)
  5. Spray nozzle made of PEEK (0,3 / 0,5 mm)

PERFORMANCE DATA

  • Speed range: 0 to 2’000 rpm +/-1 rpm 1)
  • Speed acceleration: 0 to 5’000 rpm in 0.5 seconds 1)
  • Process time up to 2376 seconds
  • Developer spray time 99 seconds/segment
  • Speed of the spray arm 10 to 200 mm/second
  • Rinse and N2 drying 99 seconds/segment
  • Spray nozzle made from PEEK 0,8mm

For more details or the documentation please contact our Sales Team via contact form

Developer SMD-900

The developer SMD-900 is designed to clean and to develop substrates up to Ø 900 mm or 600 x 600mm (24 × 24″), maximum substrate weight 10 kg.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments, each can be programmed
  2. Quick start/stop function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameter: speed, acceleration, process time, speed of the spray arm
  5. Electrical driven spray arm, with dynamic or static function
  6. Developer line and media tank for one developer included
  7. Nozzle for DI-water-rinse and N2 drying on the spray arm
  8. Two nozzles in the process bowl for backside rinse
  9. Rotational direction can be selected (CW, CCW)
  10. Manual loading and unloading of the substrates
  11. Substrate fixation with vacuum ring, mechanical centering
  12. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional developer lines (up to 3 developer lines possible)
  2. Start/stop foot switch for ease of operation (cable
    length 1.8 m)
  3. Developer tank heating system (2 litre)
  4. Spray nozzle made of PEEK (0,3 / 0,5 mm)

PERFORMANCE DATA

  • Speed range: 0 to 2’000 rpm +/-1 rpm 1)
  • Speed acceleration: max. 300 rad/s” (unloaded)
  • Process time up to 4’320 seconds with 0,1 sec. steps
  • Speed of the spray arm 0 to 200 mm/second
  • Spray nozzle made from PEEK 0,8 mm

1) Slower speed and acceleration for heavy substrates recommended

For more details or the documentation please contact our Sales Team via contact form

CP series: controlled cooling

SAWATEC offers a variety of coolplates designed for fast and controlled cooling of flat substrates. The coolplate series minimizes waiting times for substrate or wafer cooling. For even faster cooling, a chiller can be used to increase the cooling rate.

The manual and semi-automatic coolplates are known for their high-quality design and user-friendly operation.

You can choose between bench-mounted or cabinet versions of the coolplates, depending on your specific requirements.

CP-200

Coolplate CP-200

The Coolplate CP-200 is specifically designed for thermal management in the semiconductor and MEMS industry, offering efficient cooling for wafers. It is compatible with substrates up to Ø 200 mm and thicknesses up to 14 mm. Additionally, it supports wafers ranging in size from 50 x 50 to 200 x 200 mm, whether they are round or square in shape. 

The manual and semi-automatic Coolplate CP-200 stands out for its robust design, ensuring durability and longevity. It also offers ease of operation, making it convenient and user-friendly for various cooling processes.

FEATURES (BASIC CONFIGURATION)

 

  1. Temperature control with digital target and actual value display
  2. User-friendly process configuration with touch screen panel
  3. Quick start/stop function for repeat processes
  4. Automatic temperature limit switch
  5. Proximity as well as loading pins, can be easily adapted to different substrate sizes
  6. Manual substrate fixation via vacuum
  7. Manual loading and unloading of substrates

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Simple setup tool for optimal alignment of the coolplate.

PERFORMANCE DATA

  • Temperature range: 5 – 23°C 
  • Electrical driven proximity and loading pins 
  • Proximity adjustment from 0-1 mm (0.1 mm steps) 
  • Substrate size: max. 200 mm (round or square)
  • Coolramp with 24 program steps possible 
  • Manual substrate fixation via vacuum

For more details or the documentation please contact our Sales Team via contact form

SM Series: Coating2

SAWATEC offers manual spin modules designed for substrates with smooth or minimal surface structures. These modules provide user-friendly operation and a wide range of application-specific chucks, allowing for flexibility in substrate usage. They can uniformly coat all commercial photoresists on wafers up to 900 mm or 600 x 600 mm (24 x 24″) substrates.

The SM series stands out for its high level of uniformity, repeatability, ease of operation, and comfortable handling. To minimize the cleaning effort for the process chamber, SAWATEC has developed a comprehensive and cost-effective bowl protector. This removable protector reduces maintenance requirements. As a result, SAWATEC spin modules are preferred for laboratories, R&D facilities, pilot projects, and institutes.

The compact SM series is available as portable bench-top, bench-mounted, or mobile cabinet units, providing versatility and convenience for different setups.

SM-150

SM-200

SM-300

SM-600

SM-900

Spin Module SM-150

The Spin Modules SM-150 are specifically designed for manual and semi-automatic coating of thin layers. These modules offer excellent homogeneity when coating with various commercial photoresists and coating materials. They are suitable for wafers up to 150 mm (6 inches) or 127 x 127 mm (5 x 5 inches) in size. The process chamber is designed to accommodate a diameter of up to 176 mm.

The SM-150 spin modules are known for their high precision and great value. They are available in portable bench-top and bench-mounted units, providing flexibility and convenience for different usage scenarios.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameters: speed, acceleration, time
  5. Rotational direction can be selected (CW, CCW)
  6. Manual loading and unloading of the substrates
  7. Substrate fixation via vacuum and safety interlock protection
  8. Manual cover with air flow inlet and sensor lock control
  9. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Semi-automatic cartridge dispensing system, 50 ml glass syringe with manual dispensing arm and recirculation function
  2. Manual nitrogen (N2) purge of the process chamber
  3. Start/stop foot switch for ease of operation (cable
    length 1.8 m)
  4. Bowl assembly made of anodised aluminium
  5. Bowl protector made of aluminium or PE
  6. Vacuum pump for SM-150 module
  7. Wafer alignment tool 2 – 6” (round)

PERFORMANCE DATA

  1. Speed range: 0 to 10’000 rpm +/-1 rpm
  2. Speed acceleration: 0 – 8’000 rpm in 0,8 sec. / 0 – 10’000 rpm in 1 sec. 1)
  3. Delay: 10’000 rpm – 0 in 2,5 sec. / 8’000 rpm – 0 in 0,8 sec. 1)
  4. Process time up to 2376 seconds
  5. Dosing time 99 seconds/segment

Depending on the substrate size and spin chuck type

For more details or the documentation please contact our Sales Team via contact form

Spin Module SM-200

The SM-200 Spin Modules are the ideal choice for achieving semi-automatic coating of thin layers. They provide excellent coating uniformity for all commercially available photoresists and coating materials on wafers up to 200 mm (8 inches) or 150 x 150 mm (6×6 inches) substrates.

With the innovative Round-Closed Chamber Technology (RCCT) system, air turbulence over the rotating substrate is effectively reduced. This technology facilitates faster saturation of solvents within the closed chamber, leading to slower drying of the photoresist. As a result, the coating process becomes more homogeneous, and significant savings in media consumption are achieved.

These high-precision instruments are available in both mobile cabinet and bench-mounted configurations, offering flexibility and versatility for various laboratory and production settings.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start/stop function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameters: speed, acceleration, time
  5. Rotational direction can be selected (CW, CCW)
  6. RCCT system (Round-Closed-Chamber-Technology)
  7. Dynamic dispense arm prepared for up to 4 media lines
  8. Manual loading and unloading of the substrates
  9. Substrate fixation via vacuum and safety interlock protection
  10. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional dispensing lines including precision dosing pumps or syringe
  2. Automatic cartridge dispensing system, 50 ml glass syringe CDS-50
  3. Top side edge bead removal (EBR circular and linear)
  4. Automatic nozzle cleaning including solvent pump
  5. Program controlled Filter Fan Unit (FFU)
  6. Bowl protection insert for easy and efficient cleaning
  7. Wafer alignment tool 1” – 12” (round)

PERFORMANCE DATA

  • Speed range: 1 to 6’000 rpm +/-1 rpm (optional 10’000 rpm for wafers smaller than 8″)
  • Difference from set rotation speed to actual value < +/-1 %
  • Speed acceleration: 0 – 6’000 rpm in 0,8 sec.
  • Delay: 6’000 – 0 rpm in 0,8 sec.
  • Process time up to 7’200 seconds with 0,1 sec. steps
  • Dosing time depends on pump type

For more details or the documentation please contact our Sales Team via contact form

Hotplate HP-300

The SM-300 Spin Modules offer an optimal solution for achieving semi-automatic coating of thin layers. They ensure the homogeneous coating of all commercially available photoresists and coating materials on wafers up to 300 mm (12 inches) or 200 x 200 mm (8 × 8 inches) substrates.

With the innovative Round-Closed Chamber Technology (RCCT) system, air turbulence over the rotating substrate is effectively minimized. This technology facilitates faster saturation of solvents within the closed chamber, resulting in slower drying of the photoresist. The end result is a more uniform coating process with significant savings in media consumption.

These high-precision instruments are available in both mobile cabinet and bench-mounted configurations, providing flexibility and versatility for various laboratory and production environments.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start/stop function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameters: speed, acceleration, time
  5. Rotational direction can be selected (CW, CCW)
  6. RCCT system (Round-Closed-Chamber-Technology)
  7. Dynamic dispense arm prepared for up to 4 media lines
  8. Manual loading and unloading of the substrates
  9. Substrate fixation via vacuum and safety interlock protection
  10. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional dispensing lines including precision dosing pumps or syringe
  2. Automatic cartridge dispensing system, 50 ml glass syringe CDS-50
  3. Top side edge bead removal (EBR circular and linear)
  4. Automatic nozzle cleaning including solvent pump
  5. Program controlled Filter Fan Unit (FFU)
  6. Bowl protection insert for easy and efficient cleaning
  7. Wafer alignment tool 1 – 12” (round)

PERFORMANCE DATA

  • Speed range: 1 to 6’000 rpm +/-1 rpm (optional 10’000 rpm for wafers smaller than 8″)
  • Difference from set rotation speed to actual value < +/-1 %
  • Speed acceleration: 0 – 6’000 rpm in 0,8 sec.
  • Delay: 6’000 – 0 rpm in 0,8 sec.
  • Process time up to 7’200 seconds with 0,1 sec. steps
  • Dosing time depends on pump type

For more details or the documentation please contact our Sales Team via contact form

Hotplate HP-600

The SM-600 Spin Modules are the ideal solution for achieving semi-automatic coating of larger substrates. They enable the homogeneous coating of all commercially available photoresists and coating materials on wafers up to 600 mm or 16 × 16 inch substrates.

Featuring the innovative Round-Closed Chamber Technology (RCCT) system, these modules effectively minimize air turbulence over the rotating substrate. By rapidly saturating the atmosphere with solvents in the closed chamber, the RCCT system ensures slower drying of the photoresist, resulting in a more uniform and homogeneous coating process. Moreover, this technology enables remarkable savings in consumed media.

These high-precision instruments are available exclusively as mobile cabinet units, providing convenience and flexibility for various coating applications.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameters: speed, acceleration, time
  5. Rotational direction can be selected (CW, CCW)
  6. RCCT system (Round-Closed-Chamber-Technology)
  7. Dynamic dispense arm prepared for up to 4 media lines
  8. Dispensing pump SP-50 for viscosities up to 800 cps including suck-back function
  9. Manual loading and unloading of the substrates
  10. Substrate fixation via vacuum and safety interlock protection
  11. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Automatic cartridge dispensing system CDS-50, 50 ml glass syringe
  2. Top side edge bead removal (EBR circular)
  3. Additional dispensing line including precision dosing pumps
  4. Start/stop foot switch for ease of operation (cable
    length 1.8 m)
  5. PR tank heating system (2 ltr.)

PERFORMANCE DATA

  • Speed range: 1 to 2’000 rpm +/-1 rpm
  • Difference from set rotation speed to actual value < +/-1 %
  • Speed acceleration: 0 – 5’000 rpm in 0.5 sec. (unloaded)
  • Delay: 5’000 rpm – 0 in 0,5 sec.
  • Process time up to 2’376 seconds per segment with 0.1 sec. steps
  • Dosing time 99 seconds/segment

For more details or the documentation please contact our Sales Team via contact form

Hotplate HP-900

The SM-900 Spin Modules are specifically designed for semi-automatic coating of larger substrates. These modules are suitable for substrates with no or very low surface structures. They enable the homogeneous coating of all commercially available photoresists and coating materials on wafers up to 900 mm or 600 x 600 mm (24 × 24″) substrates.

Equipped with a protection disk, these modules effectively reduce air turbulence over the rotating substrate. This feature significantly improves coating uniformity by quickly saturating the atmosphere within the closed process chamber with solvents. As a result, the resist dries more slowly, leading to a more uniform and homogeneous coating process. Additionally, this technology allows for remarkable savings in consumed media.

The SM-900 Spin Modules are high-precision instruments that are available exclusively as mobile cabinet units. This ensures their versatility and ease of use for various coating applications.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start/stop function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameters: speed, acceleration, time
  5. Rotational direction can be selected (CW, CCW)
  6. Dynamic dispense arm prepared for up to 3 media lines
  7. Dispensing pump SP-50 for viscosities up to 800 cps including suck-back function
  8. Manual loading and unloading of the substrates
  9. Substrate fixation via vacuum and safety interlock protection
  10. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional dispensing line including precision dosing pumps
  2. Top side edge bead removal (EBR circular)
  3. Automatic needle cleaning
  4. Start/stop foot switch for ease of operation
    (cable length 1.8 m)

PERFORMANCE DATA

  • Speed range: 1 to 2’000 rpm +/-1 rpm
  • Difference from set rotation speed to actual value < +/-1 %
  • Speed acceleration: max. 300 rad/s” (unloaded)
  • Process time up to 300 seconds per segment with 0.1 sec. steps

For more details or the documentation please contact our Sales Team via contact form

iSPRAY Series: 3D Microstructures

The iSPRAY series by SAWATEC is designed to provide highly homogeneous coating for substrates with highly structured wafer topography, deep MEMS structures, or non-planar surface textures. It is a high-precision spray coater that is specifically used in research and development laboratories, pilot productions, and small production units in MEMS fabrication.

The iSPRAY series ensures that the coating is evenly distributed, minimizing any variations caused by surface irregularities. This makes it ideal for achieving consistent and uniform coatings on challenging substrates. With its precision and reliability, the iSPRAY series meets the demands of specialized coating processes in MEMS fabrication.

iSPRAY-300

iSPRAY-300

The iSPRAY series, when used with low-viscosity photoresists such as Shipley 1813, AZ 4999, AZ 9260, and TI Spray, offers excellent spray coating capabilities. The specially optimized spray nozzle generates fine droplets, ensuring precise and uniform coating. The spray coating process occurs within a closed process chamber, utilizing a loop-shaped spray pattern, which guarantees uniform coating across the entire substrate surface and consistent results. The iSPRAY series can accommodate both round and square substrates, allowing for the coating of up to 8 wafers simultaneously.

Specifically, the iSPRAY-300 spray coater is designed to handle wafers with a maximum diameter of 300 mm or 12 x 12 inch substrates. It is tailored to meet the needs of larger-sized substrates, providing efficient and reliable spray coating capabilities.

FEATURES (BASIC CONFIGURATION)

 

  1. Quick start function for repeat processes
  2. User-friendly process confi guration with touch screen panel
  3. Process parameters: spray pattern, spray arm speed, distance of spray nozzle, spray beam cone (x- and y-axis direction), number of spray layers
  4. Electrically operated spray arm with selectable speed in the direction of the x-axis and the y-axis
  5. Adjustable spray nozzle with constant nozzle pressure
  6. Automatic cleaning function
  7. Manual loading and unloading of the substrates
  8. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

In addition to the standard spray coating method in the X and Y directions, the iSPRAY-300 offers the option of an automatic Z-lift. This feature enhances the distribution of the photoresist, particularly for substrates with specific topographies, and increases the versatility of the coating process. The automatic Z-lift allows for improved control over the coating distribution, resulting in more precise and uniform coatings.

Furthermore, the iSPRAY-300 can be equipped with a heatable chuck. This feature enables the processing of photoresists with higher viscosities while minimizing the accumulation of the resist in cavities and ensuring reliable coating of the edges. The heatable chuck helps to optimize the coating process and achieve consistent results even with challenging photoresist materials.

These additional features enhance the capabilities and versatility of the iSPRAY-300, allowing for more advanced and efficient coating processes for various substrate types and photoresist materials.

  1. Various spray nozzles Micro 3/3, 3/4, 3/5
  2. Heatable chuck up to 150° C, usable heating surface Ø 300 mm
  3. Z-lift-axis for spray nozzle
  4. Two spray nozzles with separate photoresist feeds to prevent contamination
  5. Program controlled Filter Fan Unit (FFU)

PERFORMANCE DATA

  • Spray volume: 50 cl in buff er cartridge, supply pump with level control
  • Viscosity of the spray medium: 0.3 to 25 cSt (μPas)
  • Spray nozzle: droplet size < 7 micron, type Micro 3
  • Speed and position accuracy of the spray arm: max. 300 mm/s; ±0.1 mm
  • Number of spray cycles: max. 20 meanders
  • Ambient temperature: +4° C to +60° C

1) Slower speed and acceleration for the process recommended

For more details or the documentation please contact our Sales Team via contact form

SMD series: Highly Efficient

The development of exposed photoresist is a critical step in the process, and careful consideration must be given to the selection of the development process and its parameters. SAWATEC offers developers that can be used for both puddle and spray development, allowing for the optimal process selection based on application-specific and economic factors.

In spray development, small fine structures can be effectively released, while the puddle method requires less developer solution and is particularly suitable for substrates with deeper structures.

The SMD series of developers by SAWATEC is designed for cleaning and developing wafers up to 900mm or substrates up to 24 x 24″ (600 x 600 mm). These developers deliver high process performance, minimize chemical consumption, and offer reliable repeatability even with thick photoresist layers. The user-friendly operation and easy cleaning make them well-suited for laboratories, R&D facilities, institutes, and pilot projects.

The SMD developers are available as either bench-mounted or mobile cabinet units, providing flexibility in choosing the setup that best fits the specific requirements.

SMD-200

SMD-300

SMD-600

SMD-900

Developer SMD-200 / SMD-200-E

The SMD-200 is a versatile instrument that handles both cleaning and development processes, while the SMD-200-E extends its capabilities to include etching in addition to cleaning and development. These instruments are specifically designed to process wafers up to 8″ (200 mm) in diameter or substrates up to 6 x 6″ (150 x 150 mm) in size. The process chamber of these instruments operates effectively up to a diameter of Ø 212 mm.

For convenient use in different settings, both the SMD-200 and SMD-200-E are available as either bench-mounted or mobile cabinet units. This flexibility allows users to choose the configuration that best suits their specific needs and workspace requirements.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
  5. Electrical driven spray arm, with dynamic and static function
  6. Developer line and media tank (2 litre) for one developer included
  7. Nozzle for DI-water-rinse and N2 drying on the spray arm
  8. Nozzles in the process bowl for the backside rinse
  9. Control elements for dosing of the compressed air and vacuum
  10. Rotational direction can be selected (CW, CCW)
  11. Manual loading and unloading of the substrates
  12. Mechanical substrate fixation
  13. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional developer lines (up to 4 developer lines possible)
  2. Start/stop foot switch for ease of operation
    (cable length 1.8 m)
  3. Separation unit for media exhaust (tank and laboratory equipment)
  4. Developer tank heating system (2 litre)
  5. Spray nozzle made of PEEK or stainless steel (0,3 / 0,5mm)

PERFORMANCE DATA

  • Speed range: 0 to 3’000 rpm +/-1 rpm 1)
  • Speed acceleration: 0 to 3’000 rpm in 0.3 seconds 1)
  • Process time up to 2376 seconds
  • Developer spray time 99 seconds/segment
  • Speed of the spray arm 10 to 100 mm/second
  • Rinse and N2 drying 99 seconds/segment
  • Heatable process hood up to 50 °C
  • Spray nozzle made of PEEK (SMD-200) or stainless steel (SMD-200-E): 0.8 mm

1) Slower speed and acceleration for the process recommended

For more details or the documentation please contact our Sales Team via contact form

Developer SMD-300 / SMD-300-E

The SMD-300 is a versatile instrument designed for handling cleaning and development processes, while the SMD-300-E extends its capabilities to include etching in addition to cleaning and development. These instruments are specifically designed to process wafers up to 12″ (300 mm) in diameter or substrates up to 8 x 8″ (200 x 200 mm) in size. The process chamber of these instruments operates effectively up to a diameter of Ø 312 mm.

To accommodate different workspace configurations, both the SMD-300 and SMD-300-E are available as either bench-mounted or mobile cabinet units. This flexibility allows users to choose the configuration that best suits their specific requirements and provides convenience in their working environment.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
  5. Electrical driven spray arms, with dynamic and static function
  6. Developer line and media tank (2 litre) for one developer included
  7. Nozzle for DI-water-rinse and N2 drying on the spray arm
  8. Nozzles in the process bowl for the backside rinse
  9. Control elements for dosing of the compressed air and vacuum
  10. Rotational direction can be selected (CW, CCW)
  11. Manual loading and unloading of the substrates
  12. Mechanical substrate fixation
  13. Acoustic signal when the process has finished
  14.  

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional developer lines (up to 4 developer lines possible)
  2. Start/stop foot switch for ease of operation (cable length 1.8 m)
  3. Separation unit for media exhaust (tank and laboratory equipment)
  4. Developer tank heating system (2 litre)
  5. Spray nozzle made of PEEK or stainless steal (0,3 / 0,5 mm)

PERFORMANCE DATA

  • Speed range: 0 to 3’000 rpm +/-1 rpm 1)
  • Speed acceleration: 0 to 3’000 rpm in 0.3 seconds 1)
  • Process time up to 2376 seconds
  • Developer spray time 99 seconds/segment
  • Speed of the spray arm 10 to 100 mm/second
  • Rinse and N2 drying 99 seconds/segment
  • Heatable process hood up to 50 °C
  • Spray nozzle made of PEEK (SMD-300) or stainless steel (SMD-300-E): 0,8 mm

1) Slower speed and acceleration for the process recommended

For more details or the documentation please contact our Sales Team via contact form

Developer SMD-600

The SMD-600 developer is specifically designed for cleaning and developing substrates with dimensions of up to 400 x 400 mm. The process chamber of the SMD-600 can accommodate substrates with a diameter of up to 600 mm, providing ample space for the development process.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
  5. Electrical driven spray arm, with dynamic or static function
  6. Developer line and media tank for one developer included
  7. Nozzle for DI-water-rinse and N2 drying on the spray arm
  8. Control elements for dosing of the compressed air and vacuum
  9. Rotational direction can be selected (CW, CCW)
  10. Manual loading and unloading of the substrates
  11. Mechanical substrate fixation
  12. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional developer lines (up to 4 developer lines possible)
  2. Start/stop foot switch for ease of operation (cable length 1.8 m)
  3. Separation unit for media exhaust (tank and laboratory equipment)
  4. Developer tank heating system (2 litre)
  5. Spray nozzle made of PEEK (0,3 / 0,5 mm)

PERFORMANCE DATA

  • Speed range: 0 to 2’000 rpm +/-1 rpm 1)
  • Speed acceleration: 0 to 5’000 rpm in 0.5 seconds 1)
  • Process time up to 2376 seconds
  • Developer spray time 99 seconds/segment
  • Speed of the spray arm 10 to 200 mm/second
  • Rinse and N2 drying 99 seconds/segment
  • Spray nozzle made from PEEK 0,8mm

For more details or the documentation please contact our Sales Team via contact form

Developer SMD-600

The developer SMD-900 is designed to clean and to develop substrates up to Ø 900 mm or 600 x 600mm (24 × 24″), maximum substrate weight 10 kg.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments, each can be programmed
  2. Quick start/stop function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameter: speed, acceleration, process time, speed of the spray arm
  5. Electrical driven spray arm, with dynamic or static function
  6. Developer line and media tank for one developer included
  7. Nozzle for DI-water-rinse and N2 drying on the spray arm
  8. Two nozzles in the process bowl for backside rinse
  9. Rotational direction can be selected (CW, CCW)
  10. Manual loading and unloading of the substrates
  11. Substrate fixation with vacuum ring, mechanical centering
  12. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional developer lines (up to 3 developer lines possible)
  2. Start/stop foot switch for ease of operation (cable
    length 1.8 m)
  3. Developer tank heating system (2 litre)
  4. Spray nozzle made of PEEK (0,3 / 0,5 mm)

PERFORMANCE DATA

  • Speed range: 0 to 2’000 rpm +/-1 rpm 1)
  • Speed acceleration: max. 300 rad/s” (unloaded)
  • Process time up to 4’320 seconds with 0,1 sec. steps
  • Speed of the spray arm 0 to 200 mm/second
  • Spray nozzle made from PEEK 0,8 mm

1) Slower speed and acceleration for heavy substrates recommended

For more details or the documentation please contact our Sales Team via contact form

SRD Series: Absolute Purity

SAWATEC spin rinser dryers feature closed stainless steel process chambers and integrated imbalance compensation. The SRD-series stands out for its exceptional process quality and high productivity.

The inclusion of an innovative cassette holder allows for easy tool-free swapping between three different cassette sizes.

These spin rinser dryers are available as mobile cabinet units and can also be integrated as a key component within wet-chemical systems, offering versatility and integration options to suit various operational needs.

SRD-150-4S

Spin Rinser Dryer SRD-150-4S

The SRD-150-4S Spin Rinser Dryer is designed for easy operation and handling. It serves as a cooling and drying centrifuge for effectively cleaning wafers or substrates after wet-chemical processes. The centrifugal force and heated nitrogen facilitate efficient drying.

The process chamber, as well as the cassette rotor, is specifically designed to accommodate a substrate diameter of 150 mm. The SRD-150-4S has a maximum load capacity of 4 wafer cassettes, with each cassette capable of holding up to 25 wafers.

With its user-friendly design and efficient cleaning and drying capabilities, the SRD-150-4S Spin Rinser Dryer offers a reliable solution for post-processing wet-chemical treatments.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameters: speed, rinse and dry time, rinse and dry temperature, process chamber temperature
  5. Cassettes fixation mechanically with side holder
  6. Pneumatic driven cover with two hand operation
  7. Automatic imbalance compensation up to 100gr. imbalance
  8. Manual loading and unloading of the cassettes
  9. Acoustic and optical signal when process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Customized cassette sizes
  2. Customized rotor for masks-application

PERFORMANCE DATA

  • Loading capacity: Max. 100 wafers (4 wafer cassettes each with 25 slots)
  • Cassette sizes from 4 to 6”
  • Speed range: 0 to 1’500 rpm +/-1 rpm
  • Rinse time: 99 seconds/segments
  • N2 dry time: 99 seconds/segments
  • Rinse and dry temperature: up to 100 °C
  • Process chamber temperature: up to 70 °C

For more details or the documentation please contact our Sales Team via contact form